Showing results: 121 - 132 of 132 items found.
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FH-Series ID -
Teledyne FLIR
The FLIR FH-Series ID are ruggedized, multispectral fixed cameras that integrate industry-leading thermal imaging with 4K visible imaging to provide reliable intruder-detection capabilities for perimeter security. Built-in convolutional neural network (CNN) analytics accurately detect and classify human and vehicle threats moving at high or low speeds, minimizing false alarms and daily operations costs. Custom scheduling enables security operators to set intrusion analytics to run on visible streams during the day and on thermal streams throughout the night, establishing optimized coverage for any lighting condition.
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Ripsaw® EV3-F4 -
Textron Systems
With speeds up to 55 mph, Howe & Howe’s Ripsaw EV3-F4 is the world’s fastest dual-tracked vehicle. Designed and engineered as an extreme, all-terrain vehicle, this platform is developed for high-speed mobility with up to 1,500 hp. The EV3-F4’s heavy-duty, rubber tracks allow the vehicle to traverse steep slopes and loose terrains such as mud, sand and snow with ease. Featuring a floating cockpit, EV3-F4 can hold up to four passengers and comes with a high intensity light package, GPS stereo system and a backup camera. EV3-F4 is the perfect mix of rugged and luxury for extreme off-road enthusiasts.
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xiSpec -
XIMEA GmbH
*Smallest Hyperspectral camera - Compact, lightweight with only 26.4 x 26.4 x 31 mm, 32 grams (1)*Cost efficient - Excellent value and price through utilizing new imec hyperspectral imaging technology*Cool economy - Low power consumption with 1.6 Watt, minimal heat dissipation, ideal for UAV / UAS*All-around support - USB 3.0 support for Windows 7 and 10, macOS, Linux, ARM*Powerful potential - Highest spatial and spectral resolution, possible with 5Gb/s interface*Optimized - 2048 parallel, "on-chip" integrated spectroscopes with 100 points of spectral resolution each*AIA standard - USB3 Vision standard compliant*Industry standard interface - Compatible with USB 3.0 SuperSpeed specification*Fastest Hyperspectral camera - High speed, high frame rate: based on 170 fps at 2.2 Mpix resolution*Connectivity and Synchronization - Programmable optoisolated input and output, 3 status LEDs*Easy deployment - Range of accessories and wide hardware and software integration*Highly Customizable - Variety of sensor options, which can be further adjusted to match requirements*Interoperability increase - Continuous embrace of new software and hardware partners
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XiSpec -
XIMEA GmbH
*Smallest Hyperspectral camera - Compact, lightweight with only 26.4 x 26.4 x 31 mm, 32 grams (1)*Cost efficient - Excellent value and price through utilizing new imec hyperspectral imaging technology*Cool economy - Low power consumption with 1.6 Watt, minimal heat dissipation, ideal for UAV / UAS*All-around support - USB 3.0 support for Windows 7 and 10, macOS, Linux, ARM*Powerful potential - Highest spatial and spectral resolution, possible with 5Gb/s interface*Optimized - 2048 parallel, "on-chip" integrated spectroscopes with 100 points of spectral resolution each*AIA standard - USB3 Vision standard compliant*Industry standard interface - Compatible with USB 3.0 SuperSpeed specification*Fastest Hyperspectral camera - High speed, high frame rate: based on 170 fps at 2.2 Mpix resolution*Connectivity and Synchronization - Programmable optoisolated input and output, 3 status LEDs*Easy deployment - Range of accessories and wide hardware and software integration*Highly Customizable - Variety of sensor options, which can be further adjusted to match requirements*Interoperability increase - Continuous embrace of new software and hardware partners
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Oryx 10GigE -
Teledyne FLIR
The award-winning Oryx 10GigE camera family allows systems designers to take advantage of the latest sensors by supporting transfer speeds of up to 10 Gbit/s enabling capture of 4K resolution, 12-bit images at over 60 FPS. Oryx features include IEEE1588 clock synchronization and full compatibility with several popular third-party software supporting GigE Vision. Reliable image transfer at high bandwidth is further improved with Myricom bundles and packet resend feature. Oryx’s 10GBASE-T interface is a proven and widely deployed standard that provides reliable image transfer at cable lengths over 50 meters on inexpensive CAT6A, and up to 30 meters on CAT5e.
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Xtium-CXP PX8 -
Teledyne DALSA
The Xtium™-CXP is based on the industry standard PCI Express™ Gen 2.0 expansion bus to deliver high speed access to host memory. The Xtium series offers high performance frame grabbers for CameraLink, CameraLink HS and CoaXPress interface standards. The Xtium Series takes full advantage of PCIe Gen 2.0 platform to deliver bandwidth up to 3.4 GB/s using PCIe x8 slots. By enabling maximum sustained throughput and ready-to-use image data, the Xtium series minimizes CPU usage and improves processing times for the host applications. In addition, the Xtium series offers enhanced memory architecture to handle area and line scan, monochrome and color cameras. In addition, the Xtium-CXP series support image acquisition rate of up to 6.25 Gb/s from four input channels.
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QTouch 1408 C -
Qmax Test Technologies Pvt. Ltd.
QTouch 1408 C – Automated Multi-Functional Tester with in-built camera is designed to make automatic image capturing and probing of electrical signals with ease and speed especially in PCBs with high density/high pin count device that are mounted on the PCB. It is designed to move on X, Y, Z directions making it possible to probe every component as close as 20 mils. Easy tagging feature allows the user to get the real time XY coordinates using the library information with minimal intervention. CAD import feature is available for Auto Test Generation/to extract the XY coordinates from the CAD data. Qmax Automated Multi Functional Tester can perform Board level functional test of a PCB and guided probe / Back tracking diagnostics utility to reliably test Digital, Analog and Mixed Signal PCBs and fault isolation to the PCB level or component level.
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ZOLIX
Combining volume phase holographic (VPH) grating, wavelength optimized optics and deep-cooled CCD camera, Zolix is proud to present stateof-the-art Omni-iSpecT Raman spectrograph. It solves two essential problems concerned with Raman spectroscopy, speed and sensitivity. VPH spectrograph allows you to have faster acquisition and better S/N ratio, it is ideal for low light Raman applications such as remote detection, ultra fast Raman mapping etc, its lens-based design delivers minimum distortion at focal plane and ensures best image quality, which gives you high resolution and large spectral range simultaneously, also perfect image quality is ideal for multi-channel applications without cross-talking. The Omni-iSpecT's rugged and compact design make an ideal module for in-the-field and industrial applications; It is still suitable for academic research with research-grade performance; The Omni-iSpecT also provides the SDK file for secondary development.
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xiQ -
XIMEA GmbH
*Ultra compact mini camera- Only 26.4 x 26.4 x 21.2 mm and mere 27grams (1)*Cool - Low power consumption with 1.0 to 1.8 W and minimal heat dissipation*Fastest - High speed, high frame rate: 500fps at VGA and 90fps at 4Mpix resolutions*AIA standard - USB3 Vision standard compliant*Supported - USB3 under Windows 7 and 10, macOS, Linux, ARM and various Machine Vision Libraries*Industry standard interface - Compatible with USB 3.1 Gen1 SuperSpeed specification*Powerful potential - 5 Gbit/s interface 400 MB/s data throughput*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Cost efficient - Excellent value for the price, low TCO and fast ROI*Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Easy deployment - Range of accessories and widest hardware and software interoperability*Time proven - In production since the end of 2011*User friendly - Intuitive and simple to use API, easy switch from C to CS mount and more*Highly Customizable - Available in Board level (single PCB) and with different connector types
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xiD -
XIMEA GmbH
*Quality components - Sony "EXview HAD CCD II" sensors delivering 2.8, 6.1, 9.1 and 12 Mpix*Fastest - Highest speed using full 4 TAP readout potential*Industry standard interface - Compliant with USB 3.0 SuperSpeed specification*Versatile mini camera - Subtle 60 x 60 x 39 mm, 320 grams (1)*Power - Lowest power consumption starting at 3 Watt, bus powered with USB3 cable*Cool - Minimal heat dissipation with passive COOLing*Compatibility - USB 3.0 support for Windows 7 and 10, macOS, Linux, ARM and 30 Libraries*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Bandwidth potential - 5Gb/s interface 400Mpix/s data throughput*Software interfaces - GenICam / GenTL and highly optimized xiAPI SDK for Image Processing*High grade - Quality class of sensors is combined with specially selected IR filters *Easy deployment - Range of accessories and widest hardware and software interoperability*Highly Customizable - Available in Board level and with Peltier TE Cooling
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xiX -
XIMEA GmbH
*Smallest camera featuring Sony Pregius™ - Compact with only 26.4 x 26.4 x 31 mm and 30 grams (1)*Fast CMOS - High speed, high frame rate: from 2.3 Mpix at 166 Fps to 50 Mpix at 33 Fps*Cool economy - Low power consumption with under 3 Watt and minimal heat dissipation*All-around support - support for Windows 7 and 10, macOS, Linux, ARM and embedded platforms*Industry standard - Data and control interface complies with PCI Express External Cabling Specifications*Adaptable potential - Available with two flat ribbon flex cable connectors: parallel and perpendicular *Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Connectivity and Synchronization - Programmable opto-isolated input and output, 4 status LEDs*Lens control - EF-mount Interface allows remote control of aperture, focus and image stabilization*Highly Customizable - Variety of sensor options including Sony IMX287, IMX273, IMX249, IMX265, IMX264, IMX267, IMX304 available in board level stack for OEM use and with switches and adapters*Interoperability increase - Continuous embrace of new software and hardware partners*Cost efficient - Excellent value through utilization of the newest technologies including Sony Pregius™
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Xeltek
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
